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๐Ÿ” vikas singh ๐Ÿ“‚ Engineering
Showing 45 results for "vikas singh" in Engineering
Engineering Preprint PDF DOI

ARCHE: Autoregressive Residual Compression with Hyperprior and Excitation

Sofia Iliopoulou, Dimitris Ampeliotis, Athanassios Skodras ยท 2026

Recent progress in learning-based image compression has demonstrated that end-to-end optimization can substantially outperform traditional codecs by jointly learning compact latent representations andโ€ฆ

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Engineering Preprint PDF DOI

ViTaS: Visual Tactile Soft Fusion Contrastive Learning for Visuomotor Learning

Yufeng Tian, Shuiqi Cheng, Tianming Wei, Tianxing Zhou, Yuanhang Zhang, Zixian Liu, Qianwei Han, Zhecheng Yuan, Huazhe Xu ยท 2026

Tactile information plays a crucial role in human manipulation tasks and has recently garnered increasing attention in robotic manipulation. However, existing approaches mostly focus on the alignment โ€ฆ

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Engineering Preprint PDF DOI

Artificial Magnetic Conductor Frame to Improve Impedance Matching and Radiation Symmetry in 2$\times$2 Array for 6G Applications

Edoardo Giusti, Krishan Kumar Tiwari, C.J. Reddy, Danilo Brizi, Agostino Monorchio, Giuseppe Caire ยท 2026

An Artificial Magnetic Conductor (AMC) frame capable of improving the impedance matching of a 2$\times$2 array for 6G applications without degrading isolation performance is presented. The proposed frโ€ฆ

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Engineering Preprint PDF DOI

Packet Detection in a Filter Bank-Based Ultra-Wideband Communication System

Brian Nelson, Behrouz Farhang-Boroujeny ยท 2025

Recently, filter bank multi-carrier spread spectrum (FBMC-SS) technology has been proposed for use in ultra-wideband (UWB) communication systems. It has been noted that, due to the spectral partitioniโ€ฆ

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Engineering Preprint PDF DOI

3D Electronic-Photonic Heterogenous Interconnect Platforms Enabling Energy-Efficient Scalable Architectures For Future HPC Systems

Anirban Samanta, Shun-Hung Lee, Chun-Yi Cheng, Samuel Palermo, S. J. Ben Yoo ยท 2025

3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Bandwidth Memory (HBM)โ€ฆ

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Engineering Preprint PDF DOI

Simplified Design Approach for Via Transitions up to 67 GHz

Giorgi Tsintsadze, Reza Vahdani, James L. Drewniak, Richard Zai ยท 2025

A systematic approach for high-speed via transition design is proposed. The effects of via barrel radius, anti-pad size, and the distance from adjacent stitching (GND) vias on bandwidth are analyzed aโ€ฆ

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Engineering Preprint PDF DOI

Rodent Breathing Waveforms in ApoE Rats: Statistical and Entropic Differentiation

Stephen E. Wormald, Nicholas J. Napoli, Gordon S. Mitchell, Alexandria B. Marciante ยท 2025

Apolipoprotein E (ApoE) gene variations are involved in lipid metabolism and cholesterol transport, with the ApoE4 allele being a known risk factor associated with neurodegenerative conditions later iโ€ฆ

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Engineering Preprint PDF DOI

Advanced 3D Imaging Approach to TSV/TGV Metrology and Inspection Using Only Optical Microscopy

Gugeong Sung ยท 2025

This paper introduces an innovative approach to silicon and glass via inspection, which combines hybrid field microscopy with photometric stereo. Conventional optical microscopy techniques are generalโ€ฆ

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Engineering Preprint PDF DOI

A Self-Supervised Learning of a Foundation Model for Analog Layout Design Automation

Sungyu Jeong, Won Joon Choi, Junung Choi, Anik Biswas, Byungsub Kim ยท 2025

We propose a UNet-based foundation model and its self-supervised learning method to address two key challenges: 1) lack of qualified annotated analog layout data, and 2) excessive variety in analog laโ€ฆ

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Engineering Preprint PDF DOI

SING: Semantic Image Communications using Null-Space and INN-Guided Diffusion Models

Jiakang Chen, Selim F. Yilmaz, Di You, Pier Luigi Dragotti, Deniz Gunduz ยท 2025

Joint source-channel coding systems based on deep neural networks (DeepJSCC) have recently demonstrated remarkable performance in wireless image transmission. Existing methods primarily focus on minimโ€ฆ

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Engineering Preprint PDF DOI

Unsupervised Machine Learning for Osteoporosis Diagnosis Using Singh Index Clustering on Hip Radiographs

Vijaya Kalavakonda, Vimaladevi Madhivanan, Abhay Lal, Senthil Rithika, Shamala Karupusamy Subramaniam, Mohamed Sameer ยท 2024

Osteoporosis, a prevalent condition among the aging population worldwide, is characterized by diminished bone mass and altered bone structure, increasing susceptibility to fractures. It poses a signifโ€ฆ

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Engineering Preprint PDF DOI

MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC

Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang, Ru Huang ยท 2024

Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) adopted by commโ€ฆ

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Engineering Preprint PDF DOI

FlashAudio: Rectified Flows for Fast and High-Fidelity Text-to-Audio Generation

Huadai Liu, Jialei Wang, Rongjie Huang, Yang Liu, Heng Lu, Zhou Zhao, Wei Xue ยท 2024

Recent advancements in latent diffusion models (LDMs) have markedly enhanced text-to-audio generation, yet their iterative sampling processes impose substantial computational demands, limiting practicโ€ฆ

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Engineering Preprint PDF DOI

SingIt! Singer Voice Transformation

Amit Eliav, Aaron Taub, Renana Opochinsky, Sharon Gannot ยท 2024

In this paper, we propose a model which can generate a singing voice from normal speech utterance by harnessing zero-shot, many-to-many style transfer learning. Our goal is to give anyone the opportunโ€ฆ

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Engineering Preprint PDF DOI

A Fully Screen-Printed Vanadium-Dioxide Switches Based Wideband Reconfigurable Intelligent Surface for 5G Bands

Yiming Yang, Mohammad Vaseem, Ruiqi Wang, Behrooz Makki, Atif Shamim ยท 2024

Reconfigurable Intelligent Surface (RIS) is attracting more and more research interest because of its ability to reprogram the radio environment. Designing and implementing the RIS, however, is challeโ€ฆ

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Engineering Preprint PDF DOI

FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration

Madhava Sarma Vemuri, Umamaheswara Rao Tida ยท 2023

Monolithic Three-Dimensional Integrated Circuits (M3D-IC) has become an attractive option to increase the transistor density. In M3D-IC, substrate layers are realized on top of previous layers using sโ€ฆ

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Engineering Preprint PDF DOI

A Review of the Recent Developments in the Fabrication Processes of CMOS Image Sensors for Smartphones

Kirthika Nahalingam, Linda P. B. Katehi ยท 2023

CMOS Image Sensors are experiencing significant growth due to their capabilities to be integrated in smartphones with refined image quality. One of the major contributions to the growth of image sensoโ€ฆ

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Engineering Preprint PDF DOI

VILAS: Exploring the Effects of Vision and Language Context in Automatic Speech Recognition

Ziyi Ni, Minglun Han, Feilong Chen, Linghui Meng, Jing Shi, Pin Lv, Bo Xu ยท 2023

Enhancing automatic speech recognition (ASR) performance by leveraging additional multimodal information has shown promising results in previous studies. However, most of these works have primarily foโ€ฆ

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Engineering Preprint PDF DOI

AlignSTS: Speech-to-Singing Conversion via Cross-Modal Alignment

Ruiqi Li, Rongjie Huang, Lichao Zhang, Jinglin Liu, Zhou Zhao ยท 2023

The speech-to-singing (STS) voice conversion task aims to generate singing samples corresponding to speech recordings while facing a major challenge: the alignment between the target (singing) pitch cโ€ฆ

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Engineering Preprint PDF DOI

A Wideband Reconfigurable Intelligent Surface for 5G Millimeter-Wave Applications

Ruiqi Wang, Yiming Yang, Behrooz Makki, Atif Shamim ยท 2023

Despite the growing interest in reconfigurable intelligent surfaces (RISs) for millimeter-wave (mm-wave) bands, and the considerable theoretical work reported by the communication community, there is โ€ฆ

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