108+ open-access research outputs.
To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a prom…
Temporal graphs are graphs whose edges are only present at certain points in time. Reachability in these graphs relies on temporal paths, where edges are traversed chronologically. A temporal graph th…
We initiate the study of asynchronous quantum distributed systems, focusing on the case of implementing atomic quantum global operations that can be decomposed into a collection of local operations on…
Distributed time-sensitive systems must balance timing requirements (availability) and consistency in the presence of communication delays and synchronization uncertainty. This paper presents maxwait,…
Building on the well-established capacity-achieving schemes of Sun-Jafar (for replicated storage) and the closely related scheme of Banawan-Ulukus (for MDS-coded setting), a recent work by Chandan et …
RAPID-LLM is a unified performance modeling framework for large language model (LLM) training and inference on GPU clusters. It couples a DeepFlow-based frontend that generates hardware-aware, operato…
Multiparty session types are designed to abstractly capture the structure of communication protocols and verify behavioural properties. One important such property is progress, i.e., the absence of de…
International students (IntlS) in the US refer to foreign students who acquire student visas to study in the US, primarily in higher education. As IntlS arrive in the US, they face several challenges,…
Large language models (LLMs) are increasingly used to answer high-stakes study-abroad questions about admissions, visas, scholarships, and eligibility. Yet it remains unclear how reliably they advise …
Although it is not a new concept, 3D integration increasingly receives widespread interest and focus as lithographic scaling becomes more challenging, and as the ability to make miniature vias greatly…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been c…
One-shot signatures (OSS) were defined by Amos, Georgiou, Kiayias, and Zhandry (STOC'20). These allow for signing exactly one message, after which the signing key self-destructs, preventing a second m…
As the scaling of semiconductor devices nears its limits, utilizing the back-side space of silicon has emerged as a new trend for future integrated circuits. With intense interest, several works have …
As the use of Head-Mounted Displays in moving vehicles increases, passengers can immerse themselves in visual experiences independent of their physical environment. However, interaction methods are su…
The study of structural graph width parameters like tree-width, clique-width and rank-width has been ongoing during the last five decades, and their algorithmic use has also been increasing [Cygan et …
Relaxation is a critical counterbalance to the demands of modern business life. Footbaths, a simple yet highly effective therapeutic practice, have been used for centuries across various cultures to p…
Collaborative human-AI annotation is a promising approach for various tasks with large-scale and complex data. Tools and methods to support effective human-AI collaboration for data annotation are an …
Large language models (LLMs) have emerged due to their capability to generate high-quality content across diverse contexts. To reduce their explosively increasing demands for computing resources, a mi…
The explosion of machine learning model size has led to its execution on distributed clusters at a very large scale. Many works have tried to optimize the process of producing collective algorithms an…
In this paper, we work in a 2D version of the probabilistic variant of Winfree's abstract Tile Assembly Model defined by Chandran, Gopalkrishnan and Reif (SICOMP 2012) in which attaching tiles are sam…
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